Strain Measurement for Semiconductor Devices and Packages | NIST

Title: NIST Advances Strain Measurement Techniques for Semiconductor Devices

The National Institute of Standards and Technology (NIST) has been working on advanced strain measurement techniques for semiconductor devices and packages over the past decade. Strain is a critical factor that can influence both electrical and mechanical failures in devices, making accurate measurement essential for ensuring high-yield and high-performance products.

NIST’s project has delivered industrially relevant solutions for over 10 years, focusing on improving strain measurement accuracy and developing new reference materials. The lab-scale strain measurements using new analysis approaches and equipment classes demonstrated by the project help transition these measurements from lab to nearline and nearline to inline metrologies.

The lab scale outputs allow industry to reduce time and cost for cycles of learning on new process developments by enabling previously unavailable measurements of material properties. This shortens process development loops without completing fabrication and performing functional tests each cycle.

Source: https://www.nist.gov/programs-projects/strain-measurement-semiconductor-devices-and-packages

Keywords: strain measurement, nanoscale devices, semiconductor devices

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