Title: NIST Launches Grand Challenge for Advanced Semiconductor Modeling and Validation
The National Institute of Standards and Technology (NIST) has initiated a major research initiative focused on developing advanced modeling and validation techniques for semiconductor materials and devices. This Grand Challenge 4 project aims to overcome the limitations of traditional CMOS scaling by integrating multi-physics simulation and validation efforts.
Key points:
– The project addresses the challenges of scaling advanced wide bandgap semiconductor devices
– Multi-scale models predict thermal, chemical, and electrical properties at material and interface levels
– Machine learning and AI accelerate predictions and uncertainty quantification
– Data and models are integrated with existing tools and provided as open-source resources
– The goal is to enable semiconductor designers to assess the impact of material and interface changes on device properties
– The work investigates how device scaling influences defect formation due to size reductions and increased mechanical stresses
The project’s ultimate objective is to provide semiconductor designers with the necessary tools and insights to optimize materials and fabrication processes for improved yield and reliability. By developing advanced modeling techniques and making them available as open-source resources, NIST aims to accelerate the development of next-generation semiconductor technologies.
Keywords: multiscale modeling, wide bandgap semiconductors, thermodynamic properties
