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Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging | NIST

1 min read

The article discusses NIST’s research into metrology for advanced hybrid packaging bonding processes. The project aims to develop scientific understanding of surface bonding efficiency and predict bond quality through pre-bonding surface measurements. This could enable rapid Known Good Process (KGP) development, crucial for efficient chiplet manufacturing in the U.S. industry. The research has broad applications across various industries and is part of the CHIPS for America Metrology Program.

Source: https://www.nist.gov/programs-projects/metrology-materials-surfaces-and-processes-hybrid-advanced-packaging

Keywords: Metrology, Bonding, Characterization

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