Title: NIST Develops Advanced Photonic Bolometer for High-Absorption Measurements
Summary:
The National Institute of Standards and Technology (NIST) has developed a new photonic bolometer that enables precise, broadband high-absorption photonic bolometry. The device consists of several key components:
1. Photonic chip: The core component that interacts with the incident radiation light.
2. Weak thermal link: Provides thermal isolation between the photonic chip and the thermally-isolated member.
3. Thermally-isolated member: Maintains a stable temperature environment for the photonic temperature sensor.
4. Photonic temperature sensor: Detects changes in resonance frequency caused by temperature increases from absorbed radiation.
5. Chip waveguide: Facilitates optical communication between the photon absorber and the photonic temperature sensor.
6. Photon absorber: Absorbs incident radiation light, increasing its temperature and causing measurable changes in the photonic temperature sensor’s resonance frequency.
The photonic bolometer allows for precise, high-resolution measurements of incident radiation light across a broad spectrum. This technology has potential applications in various fields, including quantum computing, where precise temperature control and measurement are crucial for maintaining qubit coherence and stability.
Keywords: Photonic, Chip, Thermally, Temperature, Sensor
