The X-TREME 6G project establishes a foundational open microelectronics platform in Europe to validate key 6G candidate technologies, including sub-Terahertz wireless back-hauling, joint communication and sensing, and non-terrestrial networks. The initiative leverages best-in-class Silicon BiCMOS, InP, and heterogeneous 3D integration to develop disruptive chiplets and chipsets while integrating resource-efficient ML/AI algorithms for computationally efficient baseband extensions. By collaborating with Chips JU pilot lines, the consortium aims to create a sustainable ecosystem that empowers European industry and democratizes access to 6G capabilities beyond current hyperscaler dominance. This effort is part of the SNS Microelectronic Lighthouse vision to support the full 6G verticals and supply chain through an open experimentation framework.
Source: https://smart-networks.europa.eu/call-3-stream-c/
Keywords: chiplets, Silicon BiCMOS, heterogeneous 3D integration, sub-Terahertz, experimentation framework