ETSI has released the first specifications for the Smart Secure Platform (SSP), a next-generation secure solution designed to support 5G and IoT applications beyond traditional SIM cards. The new architecture features a flexible file system, multiple authentication methods, and a built-in toolkit while maintaining full backward compatibility with existing UICC standards. Initial specifications define the platform’s general characteristics, its integration into System on Chip (SoC) solutions, and the Serial Peripheral Interface (SPI) protocol for external communication. This open, scalable platform aims to serve diverse sectors including banking, transport, and ID management by offering a cost-efficient, highly secure foundation for multiple applications.
Keywords: Smart Secure Platform, Secure Element, UICC, authentication methods, ETSI specifications