Researchers at the National Institute of Standards and Technology (NIST) have developed a new packaging method for photonic chips designed to withstand extreme environments like space or nuclear reactors. Led by physicist Nikolai Klimov, the team adapted a NASA bonding technique known as hydroxide catalysis bonding (HCB). This approach replaces fragile organic glues with a durable, glasslike chemical bond, preventing cracks under intense heat, radiation, or freezing temperatures.
While the technique has been successfully tested and published in *Photonics Research*, it currently takes several days to complete each connection. The researchers view this as an engineering challenge that can be optimized for faster manufacturing. If scaled up, this reliable packaging method could enable quantum computing and sensing systems to function in harsh environments where traditional electronics fail.
Keywords: photonic integrated circuits, hydroxide catalysis bonding, extreme environment packaging
